. Material FR-4, High TG FR-4, , Halgon free FR4, Rogers4003, Rogers4350, Aluminum Base, etc.
2 Layer Counts 1-28 L
3 Inner Layer Base Copper Thickness HOZ, 1OZ, 2OZ, 3OZ, 4OZ
4 Out Layer Finished Copper Thickness 1OZ, 2OZ, 3OZ, 4OZ, 5oz, 6oz etc.
5 Max Finished Size 24*35inch
6 Min Line Width/Space 4/4mil
7 Board Outline Tolerance (Mechanical) ± 0.15mm
8 Board Thickness 0.20mm-6.00mm
9 Thickness Tolerance t<1.0mm± 0.1mm, t≥ 1.0mm ± 10%
11 Min Drilling Diameter 0.2mm
12 Min Drilling Slot Diameter 0.60mm
13 Min Via Pad Diameter 20mil
14 Min BGA Pad Diameter 12mil
15 Max Aspect Ratio 12: 1
16 Min Solder Thickness 9um
17 Solder Mask color Green, blue, red, yellow, etc
18 Min Solder Bridge 5mil
19 Solder Mask Hardness ≥ 6H
20 Min Silkscreen Trace width 5mil
21 Min Silkscreen Height 30mil
22 Silkscreen Color white, yellow, black
23 Min Space Between Drill To Trace 10mil(2-6L), 12mil(≥ 8L)
24 Space Between Gold Finger 10mil
25 Impedance Control Tolerance <50¦¸, ± 5¦¸;
≥ 50¦¸, ± 10%
26 Surface Finish HAL, Flash gold, Immersion gold, OSP, Immersion Tin, Immersion silver etc.
27 Flammability Rate 94V-0
28 Inspection Standard IPC-A-600F
C. (Products list: Rigid printed circuit board; Mulitlayer printed circuit board; Flex-rigid printed board, rigid-flex printed board; Metal core printed board; Flexible board/Flex PCB; Aluminum based board/Al PCB; Metal Core PCB; PCB/FPCB/FPC/MPCB/Rigid-Flex PCB)
Dielectric material: 80um